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History

1975	Founded in 1975 as the Asian marketing arm of its Netherlands-based parent, ASM International N.V.(currently owns 53.1% of ASM Pacific).
1980	Acquired ASM Assembly Automation, a manufacturer of semi-automatic wire bonder and a stamped leadframe operation.
1984	ASM Pacific Technology Ltd. developed and marketed its own fully automatic wire and die bonder machines, and also the trim and form machines.
1989	ASM Pacific Technology Limited was formally listed on the Hong Kong Stock Exchanges on January 2, 1989. The first China plant located in Shenzhen was established to manufacture parts and subassemblies. Subsequently, the leadframe stamping operation was extended to the same location in China.
1990	Part of the R&D center was extended to Singapore. ASM Singapore was established to manufacture gold wire bonders as well as other equipment such as automold and in-line solutions for factory automation. Etched leadframe operation was subsequently added into the manufacturing plant.
1994	ASM became the 5th largest Semiconductor Assembly and Packaging Equipment Manufacturer in the world.
1998	ASM’s AB339 gold wire bonder won the Semiconductor International Editor’s Choice Best Product Award in recognition of its leading-edge technology in 50-micron pad pitch bonding capability.
1999	ASM became the 3rd largest semiconductor backend equipment manufacturer in the world and received the “1999 Technological Achievement Award” from the Hong Kong Government and the “Technology Achievement Award” from the NSTB Singapore.
2000	ASM expanded its production capacity in China and became the 2nd largest semiconductor backend equipment manufacturer in the world. It achieved a record year in terms of both revenues and profits in the entire history of ASMPT.
2001	ASMPT was the only profitable semiconductor backend equipment manufacturer among the world’s major industry players during the most severe downturn ever-seen in the entire semiconductor history. ASM’s AB339 Eagle (the 2nd generation of AB339) once again won the Semiconductor International Editor’s Choice Best Product Award for the second time in recognition of its leading-edge technology in 35-micron pad-pitch bonding capability and significantly improved speed, productivity and performance. Obtained “MHQ Award” from the Singapore Government.
2002	ASMPT surpassed the long-time industry leader to become the Champion of the Assembly and Packaging Equipment Manufacturers in the world. Another enhanced gold-wire bonder model Eagle60 with 20% higher output and operating capabilities was launched.
2003	Maintaining its leadership in the semiconductor assembly and packaging equipment industry, ASMPT made further inroads in market share gain. ASM Pacific Technology Ltd. was selected by Advanced Packaging magazine as the Winners of the 2003 Advanced Packaging Awards, in the categories of: Wire Bonding, Encapsulation and Package Handling.
2004	2004 was an exciting year for ASMPT. It marked the launch of Eagle60AP wirebonder that takes wire bonding technology to a higher level with breakthrough in fine pitch bonding and looping control that offers the state-of-the-art technology to meet new packaging challenges. ASM has been consistently voted as one of the Best Suppliers for five years in a row, an award given by VLSI Research which is the leading research organization covering the semiconductor equipment and materials arena. Our AD898 glass attach diebonder and IDEALmold were selected by Advanced Packaging Magazine as the winners of the 2004 Advanced Packaging Awards in the categories of Die Attached Equipment and materials and Dispensing/Encapsulation/Molding/Underfill Equipment and Materials respectively. The Advanced Packaging Award is a prestigious award given to the finest examples of creative advancement in technology.
2005	In 2005, ASMPT proudly receives the Advanced Packaging Awards again in 3 categories. The Osprey is the winner in the Dispensing/Encapsulation/Molding/Underfill Equipment and Materials category; the Harrier is the winner in the Wire Bonding Equipment & Materials category; and the BP2000 is the winner in the Substrate & Submount Equipment & Materials category. It demonstrates that ASMPT continues to excel in her ability to meet significant industry challenges, to apply creatively new or existing technologies and to provide overall quality and consistency of performance, economic merits and throughput characteristics.