ASM’s products won the 2002 Advanced Packaging Awards in 2 categories. The AD8912 Automatic Die Bonder was the winner in the Die Placement & Attach category. While the IDEALmold™ Application, Pinnacle Gating System & Soft Technology won in the Encapsulation/Molding category.

The Advanced Packaging Award is awarded jointly by Advanced Packaging Magazine and Semicon West yearly to the finest examples of creative advancement in technology. A distinguished panel of industry experts not employed by PennWell or Advanced Packaging evaluated each submission based on its ability to meet a significant industry challenge; creative application of a new or existing technology; overall quality and consistency of performance; economic merits; and throughput characteristics.