Industrial Recognition  
 


ASM awards

Year
Product/Company
Award
2008 MCM12

Advanced Packaging Awards: Die Equipment and Materials
2008 IDEALcompress™ Advanced Packaging Awards: Dispensing/ Encapsulation/ Molding/ Underfill Equipment & Materials
2006 Osprey

Semiconductor International
Editors’ Choice Best Product 2006
2005 Osprey Advanced Packaging Awards: Dispensing/Encapsulation/Molding/Underfill Equipment & Materials
2005 Harrier

Advanced Packaging Awards:
Wire Bonding Equipment

2005 BP2000

Advanced Packaging Awards:
Substrate & Submount Equipment & Materials

2004

IDEALmold™

Advanced Packaging Awards:Encapsulation/
Molding Category
2004 AD898CC
Automatic Die Bonder
(clean cell system)
GA898CC
Automatic Glass Bonder		 Advanced Packaging Awards:Die Attach Equipment And Material Category
2004 ASM VLSI Research
Top 10 Best Suppliers

2004

IDEALmold™

Semiconductor International
Editor’s Choice Best Products” Award

2003

ASM

VLSI Research
Top 10 Best Suppliers
2003
2003
2003
New Revolutionary
Test Handler
(NRTH)
2002
ASM
2002
2002
2001
ASM
2001
Eagle-Ultra Fine
Pitch Gold Wire
Bonder
2000
ASM
1999
Singapore
1999
Hong Kong
1998
AB339 Gold
Wire Bonder
 
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