AD8912
Automatic die bonder

• Robotic wafer handling system for wafers
• up to 12"
• High accuracy with excellent productivity:
• - 320 ms system cycle time
• - ±25.4 μm @ 3 sigma XY placement
• - ±0.5° @ 3 sigma die rotation
• Universal workholder conversion for
• various packages
• Real time epoxy pattern inspection and
• position alignment