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AD8930U
/ AD8930UR
High speed eutectic die bonder /
Reel-to-reel die bonder
• 180 ms machine cycle
time
• XY placement
accuracy: ±38 µm @ 3 sigma
• Flexible work holder
system with adjustable
•
track width:
22 - 50.8 mm
• Simple in device
conversion e.g. TO92, TO126
• Maximum 500°C bonding
temperature
• Independently
controlled heater zones with
• air cooling
• Oxidation protection
by forming gas
• PR look ahead
capability
• Post-bond inspection
• Configuration for epoxy dispensing (optional)
• Applications include
SOT, TO92, IrDA,
• Micro-X, SMT
lamp and opto
coupler
• AD8930UR is for reel-to-reel material
handling
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