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AD8930V
High speed epoxy die bonder for vertical LED
application
• XY placement
accuracy: ±38 µm @ 3 sigma
• Precision bonding motion with fine
resolution at
•
X: 0.625 μm
and Y: 0.5 μm
• Precise epoxy
stamping capability with pre-bond
•
inspection
• Flexible to handle different vertical
leadframes
•
(maximum height: 72 mm)
• Rotary input track
and multi-magazine output
•
elevator material handling
•
- Suitable for multi-die bonding
applications
•
- Multi-magazine input elevator
(optional)
• Automatic die θ alignment
at wafer stage
• PR look ahead
capability
• Advanced defect inspection at wafer stage
• Applications include vertical LED, photo
transistor
• and
infrared diodes
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