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AD896
Automatic die bonder for COB devices, IrDA,
7-segment numerical
display, dot matrix display,
chip LED, metal can.
• Placement accuracy:
±38 µm
• Die rotation: ±3°
• 420 ms cycle time
• Isolated arm system
for bonding and dispensing or
• stamping
• High resolution work
holder XY table:0.5 µm
• Auto- θ
alignment system for single wafer
•
configuration
• Resolution:
0.075°/step
• Wafer PRS with PR
look ahead capability
• Advanced defect
inspection at wafer stage
• Automatic material
handling system
• Optional multi-wafer
system for multi-dice
• application
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