AD898
Automatic die bonder

• High accuracy with excellent productivity:
• - 320 ms system cycle time
• - ±25.4 μm @ 3 sigma XY placement
• - ±0.5° @ 3 sigma die rotation
• Flexible indexing clamp for substrate
• thickness of 0.1 to 2 mm
• Real time epoxy pattern inspection and
• alignment
• Automatic pre-bond and post-bond
• inspection
• Die size range: 10 x 10 to 1000 x 1000 mil
• Automatic wafer handling system to
• handle up to 8" wafer
• Flexible work holder for different
• applications
• Applications include Mini-BGA, Flex BGA,
• CSPBGA, MLP / QFN, QFP, TQFP, PLCC,
• TSSOP, TSOP, SOIC, SOT, PDIP, stacked
• CSP, Image sensor and singulated unit.