AD8912
Automatic die bonder

• Robotic wafer handling system :
• up to 12" wafers
• High accuracy and productivity:
• -320 ms system cycle time•
• -±25.4 µm @ 3 sigma
•-±25.4µm @ 3 sigma
• Universal workholder conversion for
• various packages
• Real time epoxy pattern inspection and
• position alignment