AD8912SD-A
Automatic die bonder

• Precision die bonding capability
• -XY placement accuracy: ±25 µm @ 3s
• -Die rotation: ±0.5° @ 3s
• Ultra thin die handling capability
• Flexible to handle various stacking
• algorithms
• -Pyramid stacking
• -Cross stacking
• -Stair stacking
• -Arrow stacking
• -And more