Automatic die bonder
• High accuracy and productivity:
• - 320 ms system cycle time
• - Tape/die bonding placement accuracy
• - -•±25.4 μm @ 3 sigma XY placement
• -- •±0.5° @ 3 sigma die rotation
• All-round stacked dice process
• capabilities
• Complete process optimization for thin
• die handling
• Fast package conversion time
