MCM12
Automatic Multi-Chip Module
Bonding System

• Achieving real multiple chip bonding •
• process
• Supporting various bonding processes
• - Precision direct die bonding
• - Flip chip bonding
• - SMD bonding
• Precise placement
• - XY placement : ± 10µm @ 3 sigma
• - •θ rotation : ±0.05° @ 3 sigma
• Patented gantry design
• Extra large bonding area
• - 13" x 8" addressable area
• Excellent flexibility
• - Chip tray handling
• - Supporting auxiliary dispensing station
• - Up to 14 tools changing system
• - Epoxy stamping capability
• - More than 100 dice types handling
• - capability in chip tray system
• - And more advanced features...