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AD8930MCAN
High speed epoxy die bonder for metal can
packages
• 3K UPH
• XY placement
accuracy: ±38 µm w.r.t.
• stem
• High speed bond head
with AC servo
• motion control
• 90° rotary bond arm
on XY table
• Stamper on XY table
for fine adjustment
• Automatic θ
die alignment at wafer
stage
• PR look ahead
capability
• Advanced defect
inspection at wafer
• stage
• Work holder PRS on
both dispense and
• bond positions
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