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SD890A
Soft Solder Die Bonder
• High productivity: 550 cycle time
• XY placement accuracy:
±50 µm
• XY shuttling bond head system
• suitable for matrix device
• Precision
motor control for precise
• solder wire feeding
• Self-alignment spanking system
• easy for machine calibration
• Enhancing process flexibility with 8
• independently
controlled heater
• zones
• Providing oxygen free environment
• with forming gas supply
• Automatic die theta alignment at
• wafer stage
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