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AS809
Die sorter for testing and sorting LD and LED
die into bins
• Adjustable probe
force from 5 to 20 g
• Testing stage on XY
table for precise
• probing
• XY placement
accuracy: ±50 µm
• Programmable sensor
position and
• adjustable
sensor holder
• Advanced defect
detection at wafer stage
• Capable of
integrating with various types
• of sensors and
testers
• Optional heater block
(max. 100°C) at
• testing stage
• Flexible bin table
arrangement up to 24 bin
• blocks
(optional 36)
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