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AS896
Die sorter
• LD and LED die
individually tested and
• sorted into
bins
• Adjustable probe force from 5 to 20 g
• Testing stage on XYZθ
table for precise
•
probing
• XY placement accuracy: ±38
μm
• Dual linear bond heads for pick and
place
• motion
• Programmable sensor position and
• adjustable
sensor holder
• Advanced defect detection at wafer stage
• Capable of integrating with various types of
• sensors and
testers
• Flexible bin table arrangement up to 36 bin
• blocks
(optional 56 bin blocks)
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