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MS896A
Mapping die sorter
High bonding speed:
300 ms
(within same bin)
Placement accuracy:
±38 ΅m
Die rotation: ±3°
Smartwalk - advanced
walking algorithm
Defect wafer
handling capability
- Incomplete wafer
- Broken wafer
Advanced die defects
inspection
17.3" x 6" bin table
for enlarged bin area
Configurable bin
blocks (3 types) for flexible
arrangement
Maximum 24 bin blocks
(optional 32 bin blocks)
Applications include
sorting PT / IR,
blue LED and white LED
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