IDEALcompress™

• Handles both liquid and granular encapsulants for advanced packages such as high brightness LED and high I/O ICR2R

• Capable to combine compression and dispensing technology to encapsulate LED and large format substrate [150mm (W) x 300mm (L)] and extreme thin packages

• Applicable for encapsulating materials such as Silicone, Granular Powder epoxy molding compound and Liquid epoxy compound

• This encapsulation technology will work for packages that need to provide greater functionality, performance, dome shaped, large format and thin package thickness

• Maximize asset utilization

• No mold tool cleaning is required

• Minimal material wastage as there is no formation of cull, gate and runner

• For LED application, a dual dispenser module is used. This increases the pot life of the LED material

• Epoxy material is dispensed directly onto package which translates into minimal wire sweep

• Suitable for ultra low loop wire bond application