Dispensing  
 
I DS500 ..
 
   
 


DS500
Precision dispensing system


• Glob top, dam and fill dispensing
mechanism

• Excellent epoxy placement
repeatability and dispensing quality

• Placement repeatability: ±2 mil
• Capable of handling PCB, leadframe
and custom-made carriers

• Gantry style table provides for
maximum dispense area of 17" x 17"

• Dual dispensing heads
• High precision epoxy volume control
with rotary positive displacement pump

• Needle height sensor to overcome
substrate height variation

• Needle heater to control epoxy
viscosity variation
• Vacuum work chuck with heater block
to control epoxy spread

• Built-in pattern recognition system
for automatic
substrate alignment
• Programmable dispensing patterns
andparameters

• Compliant to SMEMA electrical
equipment interface standard  
 
• Flexible automatic material handling
systems e.g. magazine to magazine
handling, reel-to-reel handling
• Applications include die coating,
adhesive dispensing, sealing, gel
coating, matrix dispensing
• Capable of handling leadframe,
ceramic, BGA, PCB, LOC,
vertical LED leadframe, etc
     


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