IDEALine™ solution for image sensor applications
This IDEALine™
process flow consists of die attach, snap curing,
wire bonding, glass attach, UV-curing, pick & place
and finally post glass attach curing. The inline is
capable of handling both singulated ceramic units in
boat carriers and BGA substrates. The unique hook
indexer design and soft clamp mechanism provide an
effective handling of the boats movement to
eliminate units shift during indexing.
Due to the stringent
contamination control requirement of the image
sensor package during assembly, innovative design
features such as ionized air blow and suctions, dust
isolation covers, die pick sequence, clean cells and
clean baths are incorporated to provide a highly
effective, field-proven dust control environment.
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