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AD9012A
Flip chip bonder
• Precise placement accuracy: ±10
μm
•
@ 3
sigma
• High productivity:
• - 0.7
sec/cycle
• Up to 12" wafer handling capability
• High process flexibility:
•
-
Flux dispensing via writing system
• - Flux dipping
• - High viscosity material dispensing
• Convertible flip chip and die bonding
• process |
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