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AD819-11A
/ AD819-11TS
High precision flip chip bonder
• XY placement
: ±10 µm
• Die rotation : ±0.5°
• 0.7 sec cycle time
• Linear bond head with 3-phase
θ axis
• Submount on work holder XY table
• Configurable bonding process: Flux /
• epoxy stamping system
• Up-looking optics for precise die
• alignment
• Applications include precision flip chip
• die attach
e.g. LD on
submount and high
• brightness LED
• AD819-11TS comes with thermosonic flip
• chip
capability:
• -
Placement accuracy: ±10 μm
@ 3 sigma
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