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AD9012TS
Thermosonic Flip Chip Bonder
• Precise placement
accuracy: ±15µm@ 3s
• High productivity:
• - 1 sec/cycle (bonding time exclusive)
• Up to 12" wafer handling capability
• Intelligent self-compensated bond force
• control
• - Regulary calibration free head design
• 4 consistent and independent heating
• system
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