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Thin Pd Plating |
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Ni/Pd/Au Pre-Plated Frame (PPF) |
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• The demand for Ni/Pd/Au PPF has been continuously increasing over the years
• because it has the following advantages over conventional tin-lead solder plating:
•-•- Reduction in packaging cost due to elimination of wet solder plating process
•-•- Green Solution due
to elimination of lead-contained solder
•-•- Elimination
of potential tin whisker formation if using lead-free solder
•-•-Compatible with standard assembly processes
• There •is analyst predicting that by year 2010, NiPdAu PPF will exceed matte tin
• and become the most popular lead frame plating scheme
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Quality Plating |
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• Pd layer plated with excellent thickness consistency, at the same time conforming to the
• morphology of base material
• Pd usage thus kept at minimum level while upkeeping uniform protection |
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Technology More Than Thickness Control |
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• Astonishing technology enlarge Pd grain size, resulting in much lesser grain boundaries
• per unit area
• This characteristic •can effectively reduce the chance of underneath Cu or Ni
• migration
• Assembly Process E•ngineers thus enjoy wider process window on wire bonding
• and•solder plating |
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