• Broad IC leadframe portfolio
• Over 250 open tools
• Design and tooling capability
• High density leadframe capability:
• 784 units/strip
• Fine inner lead pitch capability:
  0.180 mm for 100 L TQFP matrix
• Tooling capacity: 800 pins per month
• Stamping capacity: 800KK units per month
• Advanced tooling design
• Ag plating
• - Full or selective spot / ring plating
• Lead free solution:
• - Thin Pd capability (min 0.5 μ-inch)
• - Precision plating thickness measurement
• - (VXR)
• Deep downset for thermally enhanced
• package