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CS8000
CSP High Speed Tape Sorting System
Features :
• High speed: 6000 UPH
•
Net
substrate handling: (L) x (W):
•
• 235mm x 65mm (max.)
• High density and CSP handling
• capability
: from 3x3 sq mm to
•
• 23x23 sq mm
and thickness from
• 0.8
to 1.6 mm
• Package types: CSBGA, QFN,
SIP
• and many
others
• Flexible integration with third-party
• sawing
machine
• Non-nesting saw jig approach (US
• Patent
Pending)
• Ultrasonic sawn device cleaning
(US
• Patent
Pending)
• High speed dual pick arms for
• fast device
transportation
• Dual offload JEDEC tray and
• programmable width stacked tube
• Universal base device
• transportation
• Advanced vision inspection, capable
• of checking
substrate alignment, 2-D
• ball inspection and many others |
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