BP2000
New Generation Ball Placement System

Features :

• Ultra Fine Pitch CSBGA  ~  Ball Size :  
  Dia 0.2mm / Ball Pitch : 0.4mm
• Fast cycle time
• Strip form substrate – typical 10.5-15.0 sec per placement (with PR alignment)
• Singulated BGA – typical 16-17 sec per placement
• Flexible material handling capability
  • Strips / carriers boats / JEDEC trays / pallets
• Built-in diverter for easy link-up with conventional oven
• Applications - CSBGA, Flex BGA (with and without stiffener), PBGA, PBGA, Tessera® m -BGA, Singulated BGA , etc.