ASM Hummingbird, the innovative solution to the increasing demand for stud bumpers.

• Cu / Au bumping capability
• Unique features for Cu bumping
• - Unique N₂ chambers design
• - Retrofit kit at bond head to ensure oxide-free FAB
• - Cu FAB formation
• Thermosonic (TS) bonding method
• Short bumping time of 20 bumps per sec or 50 ms
• per bump
• 138 kHz transducer for low temperature process
• on wafers
• Bumping accuracy at ±3.5 µm @ 3 sigma
• Large wafer handling - 12” max
• Complete wafer protection
• - Thermal shock prevention by pre-heat and
• • post-bond stage
• - Independently controlled heater with 4 heater rods
    to ensure stable and consistent temperature
    distribution