Eagle60-03
Automatic gold wire ball
wire bonder for optoelectronic applications
• Application includes vertical LED,
• photo transistors and infrared diodes • PR look ahead
• High UPH of 22K • Advanced digital controlled bond head
• with built-in force sensor:
• - Fast and stable precise z-motion
• - Stable z-motion
• - Low and consistent impact force
• - Fast settling time of impact force
• Automatic simultaneous magazine
• transfer during bonding
• Movable heater block design to ensure
• precise fixture of LED (cup) during
bonding
• Linear motors and high-resolution
• encoders in work holder to achieve an
• accuracy of ±3 μm @ 3 sigma
