Eagle60-X2L
Ultra high speed wire bonder for hybrid application.

• One pass solution for large bond area packages
• e.g. standard ceramic of 4” x 4”, chip on board,
• printed circuit and multi-chip modules.
• Largest bond area of 88 mm Y-bondable distance
• Compact and low inertia digitally controlled
• bond head with built-in features
• Ultra fast speed up to 8 wires/sec with extreme
• precision
• Advanced loop algorithm with superior looping
t trajectory profile, auto-tuning technology
• Bond process monitoring with post-bond
• inspection, free air ball formation monitoring and
• Non-stick detection monitoring
• Bonding Area: 54mm x 102mm