Eagle60AP-LD
Wire bonder that uses swing work holder to perform multi-plane gold wire bonding

• One pass LD and submount bonding.
• Specially designed for photonics and
• optoelectronic application. Laser diode with
• 3-dimensional bonding e.g. LD assembly.
• Custom-made top plate and carrier for large
• range of laser diode products according
• customer’s specifications
• New high UPH at extreme high speed of
• 12 wires per second
• Rotary work holder system that allows 0° to
a90° programmable rotation for multi-plane
• bonding