Harrier
Dual bond head wire bonder
• Ultra high
speed (2.0 times of Eagle60)
• 50 μm BPP
• Accuracy of ±3.5 μm @ 3 sigma
• Dual wire size application
• Dual wire types: Au and Cu
• Discrete and low I/O ICs
• Two independent bonding stage and system
• Support different
work holder indexing mode
• - Left to
right magazine configuration
• - In and
out from same magazine side
• PR look ahead
to maximize the throughput
• Single path optics
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