Harrier
Dual bond head wire bonder

• Ultra high speed (2.0 times of Eagle60)
• 50 μm BPP
• Accuracy of ±3.5 μm @ 3 sigma
• Dual wire size application
• Dual wire types: Au and Cu
• Discrete and low I/O ICs
• Two independent bonding stage and system
• Support different work holder indexing mode
• - Left to right magazine configuration
• - In and out from same magazine side
• PR look ahead to maximize the throughput
• Single path optics