TwinEagle
Dual bond head wire bonder

• Ultra high speed (2.0 times of Eagle60)
• 35 µm ultra fine bond pad pitch capability
• Dual path optics
• Accuracy of ±3 µm @ 3 sigma
• Highest output with smallest footprint
• Independent 2-in-1 bonding system
• Workholder-reverse indexing
• Dual wire sizes
• Dual wire types: Au and Cu
• Support different work holder indexing mode
• - Left to right magazine configuration
• - In and out from same magazine side