ASM Cu Solutions

• Applications: power packages, discrete packages
• IC, QFN Products

• High accuracy with excellent productivity:
• - 14years field proven experience in Cu wire bonding
• Pioneer in fine & ultra heavy Cu wire bonding solution
• Complete Cu solution
• - 0.8-2.0mil solution
• - 2.0-3.0mil option
• - 4.0-6.0mil option
• - Bare Cu lead frame solution