iHawk
High Performance Bonding for
Discrete Applications

• Delivers up to 30% UPH gain over the
• Eagle 60
• Innovative and adaptive pattern recognition
• features
• New optical assembly for improved speed
• and accurracy
• Small ball bonding capability
• Digital control bond head
• New core modules for higher acceleration
• High speed indexing with encoder
• resolution of 1µm
• Less than 60ms for a standard wire
• Placement accuracy of 3.0µm