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Eagle Xtreme
• Bonding speed: up to 15-25% faster than predecessor
• Extremely high resolution core modules
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-XY table resolution |
:50nm |
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-Bond head Z resolution |
:100nm |
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-Force resolution for impact control |
:0.1gf |
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-Ultrasonic power resolution |
:0.3mW |
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| • Industries' best fine pitch capability |
:30µm BPP |
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| • Bond placement |
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• Wider bonding area |
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• New hardware & software controls enabling |
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-Ultra low impact process for sensitive devices
-Fast device conversion
-User friendly interface
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