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Fine pitch capability:
Ø
-
Pad pitch
: 68
µm
Ø
- Pad size : 63 x 80
µm
@1.0 mil Al wire
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Large effective bonding area: 8"
x 4"
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Hybrid bonding capability
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BQM System for material bondability
enhancement
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Vision Lead Locator (VLL) to adapt
lead size variation
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ntelligent pattern recognition
capability
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Dual colour (red-blue) lighting for
different substrates
surface
reflection
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Gold wire wedge bonding application
(option)
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60°
wire feed angle capability (option)
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