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Company Profile
Mission
History
Organization
Board
of Directors
Industrial
Recognition
Solutions
High brightness LED
Stacked Die
Image Sensor
..Applications
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Products & Services
Leadframe
Wafer
Level Packaging
Die
Bonder
Wire
Bonder
Flip
Clip Bonder
Encapsulation/Underfill
..Equipment
Post
Encapsulation
Test/Finish
Factory Automation
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News
2008 News Releases
2007 News Releases
2006 News Releases
2005 News Releases
Events
2008 Events
2007 Events
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Investor Relations
Corporate
Overview
Stock
Quotes
Financial
News Releases
Financial
Highlights
Financial
Reports
Investor
Enquiries
Investor
Registration
Contact
Us
Regional Offices
Enquiries
Investor
Relations
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