Thin Die Bonding
Thin die handling of 2 to 4 mil
Laminated wafers
Stacking by epoxy bonding
Stacking by Thermoplastic tape bonding
- tape cut and place bonding
Ultra light bond force for floating thin GaAs die on epoxy
Programmable optics for multi-level die surface PRS
Optimized dispensing for BLT and die tilt consistency
Motorized window clamp for substrate warpage control
Versatile 2-stage ejector up force profiling for ultra thin die pick up
back to stacked die
Copyright © 2004 ASMPT
..
I
Disclaimer
.
.
.
I
Privacy Policy
.
.
.
I
Terms of Use
Thin die handling of 2 to 4 mil
back to stacked die
