Automotive Electronics

ASMPT provides innovative and cost-effective solutions that help you successfully meet the industry’s demand for faster and powerful devices.

AD8312 Plus Series

Automatic Die Bonding System (12” wafer handling)

AD9312

Automatic Thermocompression Flip Chip System (12” wafer handling)

CM-LinDA

12” Automatic Die Bonder

LASER1205

UV Grooving System

LASER1205

UV Dicingᵖˡᵘˢ System

MP-TAB Series

Automatic Trim & Form System

NUCLEUS Series

Multi-Purpose Precision Pick & Place Tool

SilverSAM Series

A Sintering Innovation for Power Electronics

20 Pickheads System

SUNBIRD

Fully Automatic Turret Sorting Handler

AD832i

Automatic Die Bonding System (8” wafer handling)

Eagle AERO

For High-end IC Applications

Misc

eClip-ADVANCE

Automatic Clip Bonding System

Other Applications