CIS

ASMPT provides innovative and cost-effective solutions that help you successfully meet the industry’s demand for faster and powerful devices.

Testing & Calibration System

RADIANCE-S

State of the art Time-of-Flight (ToF) 3D Sensors Testing and Calibration System

AUTOPIA

Automatic Active Alignment System (for Automotive Camera Application)

COSMOS

Automatic 3D Sensing Alignment System

Eagle AERO

For High-end IC Applications

Lens Holder Attach System

IS600GS

Automatic Active Alignment Bonding System for Camera Module Assembly

Lens Holder Attach System

IS868LA3

Automatic Lens Holder Attach System

DI-water Cleaning System

ISCM868S

Automatic DI-Water Cleaning System

ISLinDA

Automatic Die Bonding System (12” wafer handling)

Ball Bonder OPTO/LED Wire Bonding Equipment

Harrier Xtreme

Dual-Head Extreme High Speed Wire Bonder

OPTO/LED Wire Bonding Equipment

iHawk Xpress XL

Wire Bonder

Ball Bonder OPTO/LED Wire Bonding Equipment

iHawk Xtreme

Wire Bonder

Other Applications