CIS

ASMPT provides innovative and cost-effective solutions that help you successfully meet the industry’s demand for faster and powerful devices.

CM-LinDA

12” Automatic Die Bonder

GS-PLUS

Automatic Active Alignment Bonding System (for Camera Module Assembly)

Testing & Calibration System

RADIANCE-S

State of the art Time-of-Flight (ToF) 3D Sensors Testing and Calibration System

AUTOPIA

Automatic Active Alignment System (for Automotive Camera Application)

Eagle AERO

For High-end IC Applications

Lens Holder Attach System

IS600GS

Automatic Active Alignment Bonding System for Camera Module Assembly

Lens Holder Attach System

IS868LA3

Automatic Lens Holder Attach System

DI-water Cleaning System

ISCM868S

Automatic DI-Water Cleaning System

ISLinDA

Automatic Die Bonding System (12” wafer handling)

Other Applications