ASMPT provides innovative and cost-effective solutions that help you successfully meet the industry’s demand for faster and powerful devices.
12” Automatic Die Bonder
Automatic Active Alignment Bonding System (for Camera Module Assembly)
State of the art Time-of-Flight (ToF) 3D Sensors Testing and Calibration System
Automatic Active Alignment System (for Automotive Camera Application)
For High-end IC Applications
Automatic DI-Water Cleaning System
Automatic Die Bonding System (12” wafer handling)
Automatic Lens Holder Attach System