CM-LinDA
12” Automatic Die Bonder
GS-PLUS
Automatic Active Alignment Bonding System (for Camera Module Assembly)
RADIANCE-S
State of the art Time-of-Flight (ToF) 3D Sensors Testing and Calibration System
AUTOPIA
Automatic Active Alignment System (for Automotive Camera Application)
Eagle AERO
For High-end IC Applications
ISCM868S
Automatic DI-Water Cleaning System
ISLinDA
Automatic Die Bonding System (12” wafer handling)
LA3-PLUS
Automatic Lens Holder Attach System
