RADIANCE-S
State of the art Time-of-Flight (ToF) 3D Sensors Testing and Calibration System
AUTOPIA
Automatic Active Alignment System (for Automotive Camera Application)
COSMOS
Automatic 3D Sensing Alignment System
Eagle AERO
For High-end IC Applications
IS600GS
Automatic Active Alignment Bonding System for Camera Module Assembly
IS868LA3
Automatic Lens Holder Attach System
ISCM868S
Automatic DI-Water Cleaning System
ISLinDA
Automatic Die Bonding System (12” wafer handling)
Harrier Xtreme
Dual-Head Extreme High Speed Wire Bonder
iHawk Xpress XL
Wire Bonder
iHawk Xtreme
Wire Bonder
