Computing

ASMPT provides innovative and cost-effective solutions that help you successfully meet the industry’s demand for faster and powerful devices.

AD8312 Plus Series

Automatic Die Bonding System (12” wafer handling)

AD9312

Automatic Thermocompression Flip Chip System (12” wafer handling)

LASER1205

UV Grooving System

LASER1205

UV Dicingᵖˡᵘˢ System

MP-TAB Series

Automatic Trim & Form System

20 Pickheads System

SUNBIRD

Fully Automatic Turret Sorting Handler

AD832i

Automatic Die Bonding System (8” wafer handling)

Eagle AERO

For High-end IC Applications

Misc

eClip-ADVANCE

Automatic Clip Bonding System

FIREBIRD TCB Series

Automatic Thermal Compression Bonding System

Ultrasonic Wedge Bonder

HERCULES

Heavy Aluminum Wire Bonding System

Transfer Molding

IDEALab 3G

For Research & Development and Pilot Productivity

Other Applications