ASMPT provides innovative and cost-effective solutions that help you successfully meet the industry’s demand for faster and powerful devices.

AD8312 Plus Series

Automatic Die Bonding System (12” wafer handling)

Eagle AERO

For High-end IC Applications

Transfer Molding


For Research & Development and Pilot Productivity

Transfer Molding

IDEALmold™ 3G

Automatic Encapsulation Solution (strip / reel form substrate handling)

LED Leadframes

Other Applications