Mobile Communications

Creating solutions that deliver low power consumption, robustness, reliability, cost-effectiveness and miniaturisation.

AD8312 Plus Series

Automatic Die Bonding System (12” wafer handling)

AD9312

Automatic Thermocompression Flip Chip System (12” wafer handling)

GS-PLUS

Automatic Active Alignment Bonding System (for Camera Module Assembly)

LASER1205

UV Grooving System

LASER1205

UV Dicingᵖˡᵘˢ System

MP-TAB Series

Automatic Trim & Form System

NUCLEUS Series

Multi-Purpose Precision Pick & Place Tool

20 Pickheads System

SUNBIRD

Fully Automatic Turret Sorting Handler

AD832i

Automatic Die Bonding System (8” wafer handling)

AUTOPIA

Automatic Active Alignment System (for Automotive Camera Application)

Eagle AERO

For High-end IC Applications

FIREBIRD TCB Series

Automatic Thermal Compression Bonding System

Other Applications