Articles

Realising the Smart Factory Vision through an AI-of-Things (AIoT) Approach

Realising the Smart Factory Vision through an AI-of-Things (AIoT) Approach

By Joe Tan, Business Development Director in ATS IC/DISCRETE of ASM Pacific Technology Ltd. (ASMPT)

With an AIoT approach properly put in place, the entire manufacturing value chain can be increasingly equipped with new ways to develop, innovate, and manufacture. AIoT is a massive step towards a vision of achieving the Holy Grail of zero DPPM manufacturing while boosting quality, yield and cost standards across the entire electronics manufacturing value chain.


ASMPT AIoT approach to realize the Smart Factory for electronics manufacturing is a detailed methodology requiring patience and commitment on a journey that can span years with challenges such as handling/ enabling legacy equipment, software integration efforts, and the ubiquitous ROI justifications to stakeholders, among others.


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Securing the Zero DPPM Holy Grail with Advanced Optical Inspection Technology

Securing the Zero DPPM Holy Grail with Advanced Optical Inspection Technology

By Glenn Siew, Senior Sales Manager in ATS IC/DISCRETE of ASM Pacific Technology Ltd. (ASMPT)

The latest AOI system from ASMPT enables the automotive industry to achieve zero DPPM. The system’s Optical Inspection and Quality Assurance (QA) functions provide accurate detection capability using Artificial Intelligence technology to augment the rule-based algorithms used by AOI solutions. This blends the advantages of machine accuracy and consistency with the powerful flexibility of human decision-making. In this regard, ASMPT’s blended approach is unique.


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The Evolution of Heterogeneous Integration enables the coming AI era

The Evolution of Heterogeneous Integration enables the coming AI era

By Nelson Fan, Vice President of Business Development in Advanced Packaging Technology (APT), Semiconductor Solutions, ASM Pacific Technology Ltd.

The Moore’s Law has guided the semiconductor industry for many decades. However, it is approaching to the limit when the node size gets smaller. Meanwhile, advanced node development has to be continued. To reduce the financial commitment for future node development, Heterogeneous Integration (HI) is the way forward. In order to shorten the development time in the advance packaging, working with a high-end equipment supplier - ASM Pacific Technology Ltd. can share their years-experience in R&D to overcome the challenges and save the cost. To build our AI future and enable the digital world, ASMPT will expect a greater collaboration and co-development work, together with different parties.


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Life and Death in the Hands of Camera

Life and Death in the Hands of Camera

By Au Po Lam, Benny, Yip Man Keung Choo & Wing Cheong, Adrian

COVID has brought the world into a standstill and disrupting economies. In one of the hardest hit industries, automotive sales volume growth plummeted double digit globally. In order to stand a new normal of automotive market after COVID, ADAS and autonomous driving technology would be the rising star. Cameras of variety of functions are on the rise of adoption into vehicles, propelling from safety-based consideration to user experience based synergy with the vehicle. In order to achieve the best balance of image clarity on the entire image plane, active alignment of autonomous lens modules will be the critical process for automotive lenses assembly. As the pioneer of global lens modules equipment manufacturer, ASM Pacific Technology Ltd. will share its experience from multiple perspectives.


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Pressure Sintering for High-Power Packaging

Pressure Sintering for High-Power Packaging

By Eric Kuah TH, Ding Jia Pei, D. Mouleeswaran, Richard Tang, Yuan Bin & Wilson Kwok

The rise in ECU usage in the modern internal combust ion engine ( ICE) and the growth of the EV automotive sector shows a broader trend of increasing amounts of electronics in each of these classes of automobiles.

In order for ECUs to be able to operate reliably, pressure sintering is used to create robust and reliable bonding between the semiconductor die and the substrate joined by the AgS material. Various steps of the sintering package assembly flow were described starting from printing, to final pressure sintering.


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