Knowledge Centre

The electronics and semiconductor industries are dynamic. Explore our Knowledge Centre to stay up to date with the latest industry developments and trends.

The Evolution of Heterogeneous Integration enables the coming AI era

The Evolution of Heterogeneous Integration enables the coming AI era

By Nelson Fan, Vice President of Business Development in Advanced Packaging Technology (APT), Semiconductor Solutions, ASM Pacific Technology Ltd.

The Moore’s Law has guided the semiconductor industry for many decades. However, it is approaching to the limit when the node size gets smaller. Meanwhile, advanced node development has to be continued. To reduce the financial commitment for future node development, Heterogeneous Integration (HI) is the way forward. In order to shorten the development time in the advance packaging, working with a high-end equipment supplier - ASM Pacific Technology Ltd. can share their years-experience in R&D to overcome the challenges and save the cost. To build our AI future and enable the digital world, ASMPT will expect a greater collaboration and co-development work, together with different parties.


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Life and Death in the Hands of Camera

Life and Death in the Hands of Camera

By Au Po Lam, Benny, Yip Man Keung Choo & Wing Cheong, Adrian

COVID has brought the world into a standstill and disrupting economies. In one of the hardest hit industries, automotive sales volume growth plummeted double digit globally. In order to stand a new normal of automotive market after COVID, ADAS and autonomous driving technology would be the rising star. Cameras of variety of functions are on the rise of adoption into vehicles, propelling from safety-based consideration to user experience based synergy with the vehicle. In order to achieve the best balance of image clarity on the entire image plane, active alignment of autonomous lens modules will be the critical process for automotive lenses assembly. As the pioneer of global lens modules equipment manufacturer, ASM Pacific Technology Ltd. will share its experience from multiple perspectives.


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Pressure Sintering for High-Power Packaging

Pressure Sintering for High-Power Packaging

By Eric Kuah TH, Ding Jia Pei, D. Mouleeswaran, Richard Tang, Yuan Bin & Wilson Kwok

The rise in ECU usage in the modern internal combust ion engine ( ICE) and the growth of the EV automotive sector shows a broader trend of increasing amounts of electronics in each of these classes of automobiles.

In order for ECUs to be able to operate reliably, pressure sintering is used to create robust and reliable bonding between the semiconductor die and the substrate joined by the AgS material. Various steps of the sintering package assembly flow were described starting from printing, to final pressure sintering.


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The ASM Integrated Smart Factory at Productronica 2019

The ASM Integrated Smart Factory at Productronica 2019
Alexander Hagenfeldt and Mark Odgen

At this year’s productronica, ASM offered a live show all about the Smart Integrated Factory. Check out the Interview with Alexander Hagenfeldt, ASM SMT Solutions Manager, at Productronica 2019 and enjoy the show!

Watch it here.


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ASM Digital Enterprise

ASM Digital Enterprise
Stanley Tsui
Group Chief Operating Officer

Change is the only constant thing in the world.

In ASMPT, we see changes as a source of opportunity to improve and be better. Heading into the digital era, ASMPT has been revolutionizing its manufacturing processes to take advantage of automation and data exchange. Here is our story of transformation to a smart factory.

Watch it here.


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7 Drivers of Industry 4.0

7 Drivers of Industry 4
YM Wong
Group Chief Technical Officer

As manufacturing companies gear up to move into Industry 4.0, ASMPT is working with our customers and partners to help reinvent the manufacturing industry, focusing on seven key technologies.

YM Wong, ASMPT’s Group Chief Technical Officer is here to tell us more.

Watch it here.


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The Integrated Smart SMT Factory

The Integrated Smart SMT Factory
Günter Schindler
Chief Operating Officer SMT Segment

Manufacturing companies all over the world are facing dramatic changes as a result of digital transformation, Industry 4 and Smart Manufacturing. With Industrial Internet of Things (IIoT) and connected manufacturing operations, the entire manufacturing value chain is increasingly equipped with new ways to develop, innovate, and manufacture.

ASM’s SMT Solutions Segment is helping its manufacturing customers globally to build the “Integrated Smart SMT Factory”. Based on five levels, ASM can build solutions for an end-to-end data communications concept that enables customers to produce faster, better and more cost- effectively and flexibly.

Günter Schindler, SMT´s Chief Operating Officer is here to give us some insights.

Watch it here


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