Knowledge Centre

The electronics and semiconductor industries are dynamic. Explore our Knowledge Centre to stay up to date with the latest industry developments and trends.

Demystifing Mass Bonding - ASMPT & Hangjia Net Collaboration

This infographic is brought to you by ASMPT and Hangjia Net - where we unveil and demystify our mass bonding technology. Read on to find out more how ASMPT's mass bonding technology works hand in hand to spearhead the era of micro-LED.

First published on Hangjia Net.


Read More

Being Vigilant & Managing the Course of Advanced Packaging Technology Development

First published on: Silicon Semiconductor China 

Read More

Mini LED Backlight Business Is Ready to Soar, while COB Yield Rate Is the Key for Mass Production

First published on LEDinside

Read More

ASMPT's Product VORTEX Won Hangjia Aurora Golden Award of Mini/ Micro LED for Two Consecutive Years! What are the Reasons for VORTEX’s Award?

ASM Pacific Technology's mini LED die bonder VORTEX successfully secures an award at the Hangjia Aurora Awards, held in Shenzhen,China.
Read more to find out what makes VORTEX a award-winning die bonder and how it can help you in your production.

Read More

Encapsulating the Future of High-Powered Electronics

Dr Kuah Teng Hock, Eric
Vice President of Encapsulation Technology
With special thanks to 
P. Angelito, Lin Yi, K. Haribaskar, R. Ravi, Yan Kar Weng, Eugene Wee

As the world moves inexorably towards cleaner energy sources to gradually replace fossil fuel technologies and these alternatives are electric in nature.This wave of vehicle electrification necessitates car manufacturers using a much amount of semiconductor technology for their solutions, which will subsequently lead to the design and assembly of increasingly high-powered electronics (HPE) components to power the cars of the future. Read on to see how ASMPT plays a role in pushing the globe towards a greener future. 

Read More

Is Encapsulation an Ancient Technology for Package Protection?

Dr Kuah Teng Hock, Eric
Vice President of Encapsulation Technology

The method of encapsulstion, are often mistaken to be of a dated technology. However, it might not be the case. Mr Eric Kuah, Vice President of Encapsulation Technology of ASM Pacific Technology explains why Encapsulation remains as relevant as ever. 

Read More

ASM Pacific Technology leads the upsurge and breakthrough of camera sensors

A part of our life takes place in a virtual environment and the world is greatly transformed by things like digital workplace, virtual learning, mobile web, cloud computing, and Internet of Things (IoT), indicating how smart life has truly become the new normal.

Read More

High Performance Computer System Booming AI and Cloud Computing – ASMPT Plays an Important Role

Due to the COVID-19, a new normal has emerged, and this new 'Smart Life 2.0' lifestyle has created new forms of products and technologies. With that, ASMPT is right behind powering these trends. Read on to find out how ASMPT has continually enabling the digital world. 

Read More

ASMPT Well Positioned to Ride The Next Wave of Advanced Packaging in Heterogeneous Integration

By: Mr. Lim Choon Khoon
Senior Vice President of ASM Pacific Technology
Business Unit CEO (IC/Discrete & CIS) Semiconductor Solutions

Effective from Jan 1, 2020, ASM Pacific Technology’s (ASMPT) Back-end Equipment Segment has been renamed to Semiconductor Solutions Segment. The other two segments – SMT Solutions Segment and Materials Segment remains unchanged.

Read More

RADIANCE-S: The Key to Calibration in ToF 3D Sensing Module Assembly

By: Mr. Au Po Lam, Benny Assistant Vice President — CIS
Mr. Choo Wing Cheong, Adrian Senior Market Development Manager — CIS

Fast and precise sensing is the most valuable items for HMI to enable the automation world. Since late 2018, Time-of-Flight (ToF), one of the 3D depth sensing technology, has become the new trend and has been widely implemented in various industries.

Read More