The Evolution of Heterogeneous Integration enables the coming AI era

The Evolution of Heterogeneous Integration enables the coming AI era

By Nelson Fan, Vice President of Business Development in Advanced Packaging Technology (APT), Semiconductor Solutions, ASM Pacific Technology Ltd.

The Moore’s Law has guided the semiconductor industry for many decades. However, it is approaching to the limit when the node size gets smaller. Meanwhile, advanced node development has to be continued. To reduce the financial commitment for future node development, Heterogeneous Integration (HI) is the way forward. In order to shorten the development time in the advance packaging, working with a high-end equipment supplier - ASM Pacific Technology Ltd. can share their years-experience in R&D to overcome the challenges and save the cost. To build our AI future and enable the digital world, ASMPT will expect a greater collaboration and co-development work, together with different parties.


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