AB589 Series
Rotary Head Fine Aluminum Wire Bonding System
AD211 Plus
Automatic Direct Eutectic Die Attach System
AD280 Plus
Automatic High Precision Die Attach System
AD50Lite
Automatic Die Bonding System
AD800
Automatic Die Bonder
AD8312 Plus Series
Automatic Die Bonding System (12” wafer handling)
AD832U
Automatic Eutectic Die Bonding System
AD838L-G2
Automatic Die Attach System
AD9212 Plus
Automatic Flip Chip Bonding System (12” wafer handling)
AD9312
Automatic Thermocompression Flip Chip System (12” wafer handling)
AERO Series
Automatic Wire Bonder
AEROCAM Series
A New Dimension of Wire Bonding