Products

Latest Product

AD211 Plus

Automatic Direct Eutectic Die Attach System

Latest Product Lens Holder Attach System

AD280 Plus

Automatic High Precision Die Attach System

Latest Product

AD50Lite

Automatic Die Bonding System

Latest Product

AD800

Automatic Die Bonder

Latest Product

AD8312 Plus Series

Automatic Die Bonding System (12” wafer handling)

Latest Product

AD832U

Automatic Eutectic Die Bonding System

Latest Product

AD838L-G2

Automatic Die Attach System

Latest Product Wafer Handling

AD9212 Plus

Automatic Flip Chip Bonding System (12” wafer handling)

Latest Product

AD9312

Automatic Thermocompression Flip Chip System (12” wafer handling)

Latest Product

FORCE VECTOR

The Component Tacking Tool for Silver (Ag) Sintering

Latest Product

NANO

Die Bonder and Flip Chip Bonder

Latest Product

NOVA Plus

Die Bonder and Flip Chip Bonder

Latest Product

NUCLEUS Series

Multi-Purpose Precision Pick & Place Tool

Latest Product

Photon

Automatic High Precision Die Attach System

AD210 Plus

Automatic Die Bonding System (6” wafer handling)

AD830 Plus

Automatic Epoxy Die Attach System (6” wafer handling)

AD830P-Plus

Automatic Die Bonder

AD832i

Automatic Die Bonding System (8” wafer handling)

AFC Plus

Die Bonder and Flip Chip Bonder

Misc

eClip Plus Series

Automatic Clip Bonding System

FIREBIRD TCB Series

Automatic Thermal Compression Bonding System

ISLinDA

Automatic Die Bonding System (12” wafer handling)

SD8312

Automatic Soft Solder Die Bonding System

AD830 Plus-R

Automatic Epoxy Die Attach System (6” wafer handling)